A printed circuit board manufacturer wanted to perform stress test on PCB board screw locking according to IPC9704 standard. The company wanted to undertake controlled checks to maintain quality standards, ensuring components reliability.
Board flexure control using strain gage measurement has proven very beneficial to the electronics industry, and continues to gain acceptance as a method to identify damaging manufacturing processes. However, as interconnect densities have increased and become more fragile, the potential for flexure-induced damage has increased. Many board assemblers are now required to operate under strain levels specified by their customers or component suppliers. As strain measurement technology has matured, different methodologies have developed. Variations in strain gage methodology inhibit reliable data collection and prevent data comparison across the industry.
Test and assembly steps which exceed strain limits are deemed excessive and are identified so that corrective actions can be made.
When the PCB is locked with a screw, it will deform, resulting in structural stress changes. According to the IPC9704 standard, the maximum strain rate generated by the deformation must be tested to ensure that the performance of the PCB meets the requirements of the standard.
Designed specifically for stress-strain applications, our Stress-strain Measurement System-SE-98 accommodates various sensors and is capable of measuring force, pressure, displacement, velocity, and other physical properties as well as voltage. Together with our Black Box Data Recording System-RU846 is the ideal solution for tests with strict size or weight requirements, as well as high impact intervals. In addition, interchangeable sampling layers (strain, charge, IEPE) ensure that the RU-846 fits each customer’s specific testing requirements.